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Co-authors
S. D. BaderArgonne National LaboratoryVerified email at anl.gov
novosad, v.Argonne National LaboratoryVerified email at anl.gov
M. Benjamin JungfleischDepartment of Physics and Astronomy, University of DelawareVerified email at udel.edu
Frank FradinArgonne National LaboratoryVerified email at anl.gov
Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
Anand BhattacharyaPhysicist, Argonne National LaboratoryVerified email at anl.gov
Suzanne G.E. te VelthuisArgonne National LaboratoryVerified email at anl.gov
Junjia DingHardware Engineer, Verily Life SciencesVerified email at google.com
Joseph SklenarWayne State UniversityVerified email at wayne.edu
Goran KarapetrovDrexel UniversityVerified email at drexel.edu
Z. Q. QIUProfessor of physics, University of California at BerkeleyVerified email at berkeley.edu
John KettersonNorthwestern UniversityVerified email at northwestern.edu
Clarence ChangArgonne National Lab and the University of ChicagoVerified email at kicp.uchicago.edu
vincent vlaminckMaître de Conférence, IMT-AtlantiqueVerified email at imt-atlantique.fr
Helmut SchultheissHelmholtz-Center Dresden-RossendorfVerified email at hzdr.de
Eric FullertonUniversity of California, San DiegoVerified email at ucsd.edu
Shikha JainPrincipal Research Engineer, Western DigitalVerified email at wdc.com
Oleksandr MosendzWDCVerified email at wdc.com
Chun-Yeol YouDepartment of Emerging Materials Science, DGIST, KoreaVerified email at dgist.ac.kr
Stephen M. WuAssistant Professor, University of RochesterVerified email at rochester.edu