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Co-authors
- Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
- Shenghuang Lin(林生晃)Songshan Lake Materials LaboratoryVerified email at sslab.org.cn
- Huiyu YuanZhengzhou UniversityVerified email at zzu.edu.cn
- Wei LuUniversity Research Facility in Materials Characterization and Device Fabrication, PolyU, HKVerified email at polyu.edu.hk
- Longhui (Stephen) ZENGUniversity of California, San DiegoVerified email at ucsd.edu
- Di Wu (吴翟)Professor, School of Physics and Microelectronics, Zhengzhou UniversityVerified email at zzu.edu.cn
- Prof. Feng YanChair Professor of Organic Electronics, Department of Applied Physics, The Hong Kong PolytechnicVerified email at polyu.edu.hk
- Jianhua Hao (郝建华)Chair Professor of Materials Physics and Devices, The Hong Kong Polytechnic University(香港理工大学)Verified email at polyu.edu.hk
- Qingming ChenSun Yan-sen UniversityVerified email at mail.sysu.edu.cn
- Lin-Bao Luo (罗林保)Hefei University of Technology (合肥工业大学微电子学院教授)Verified email at hfut.edu.cn
- Gongxun Bai (白功勋)China Jiliang UniversityVerified email at cjlu.edu.cn
- Jiong Zhao(赵炯)HKPUVerified email at polyu.edu.hk
- Prof. Yuen Hong TSANGProfessor, Applied Physics, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
- Chun Hin MakThe Hong Kong Polytechnic UniversityVerified email at connect.polyu.hk
- Wei JiDepartment of Physics, Renmin University of ChinaVerified email at ruc.edu.cn
- Jiasheng QianUniversity of AlbertaVerified email at ualberta.ca
- K W EdmondsUniversity of NottinghamVerified email at nottingham.ac.uk
- Yanghui LiuSUN YAT-SEN UNIVERSITYVerified email at nimte.ac.cn
- Zheng-Long XUHong Kong Polytechnic UniversityVerified email at polyu.edu.hk
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Yanyong Li
The depatement of Applied Physics, Hong Kong Polytechnic University
Verified email at polyu.edu.hk