Follow
Katsuyuki Sakuma
Katsuyuki Sakuma
Research Staff Member, IBM Thomas J. Watson Research Center
Verified email at us.ibm.com - Homepage
Title
Cited by
Cited by
Year
Three-dimensional silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, MJ Interrante, CS Patel, ...
IBM Journal of Research and Development 52 (6), 553-569, 2008
5272008
Future system-on-silicon LSI chips
M Koyanagi, H Kurino, KW Lee, K Sakuma, N Miyakawa, H Itani
IEEE micro 18 (4), 17-22, 1998
4191998
3D silicon integration
JU Knickerbocker, PS Andry, B Dang, RR Horton, CS Patel, RJ Polastre, ...
2008 58th Electronic Components and Technology Conference, 538-543, 2008
2822008
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, CS Patel, BC Webb, ...
IBM Journal of Research and Development 52 (6), 611-622, 2008
1812008
Intelligent image sensor chip with three dimensional structure
H Kurino, KW Lee, T Nakamura, K Sakuma, KT Park, N Miyakawa, ...
International Electron Devices Meeting 1999. Technical Digest (Cat. Noá…, 1999
1621999
New three-dimensional wafer bonding technology using the adhesive injection method
TMT Matsumoto, MSM Satoh, KSK Sakuma, HKH Kurino, NMN Miyakawa, ...
Japanese journal of applied physics 37 (3S), 1217, 1998
1211998
3D chip stacking technology with low-volume lead-free interconnections
K Sakuma, PS Andry, B Dang, J Maria, CK Tsang, C Patel, SL Wright, ...
2007 Proceedings 57th Electronic Components and Technology Conference, 627-632, 2007
1002007
Development of three-dimensional integration technology for highly parallel image-processing chip
KW Lee, TNT Park, HSY Kim, HKH Kurino, MKM Koyanagi
Japanese Journal of Applied Physics 39 (4S), 2473, 2000
772000
IMC bonding for 3D interconnection
K Sakuma, K Sueoka, S Kohara, K Matsumoto, H Noma, T Aoki, Y Oyama, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTCá…, 2010
722010
Characterization of stacked die using die-to-wafer integration for high yield and throughput
K Sakuma, PS Andry, CK Tsang, K Sueoka, Y Oyama, C Patel, B Dang, ...
2008 58th Electronic Components and Technology Conference, 18-23, 2008
572008
10 Ám fine pitch Cu/Sn micro-bumps for 3-D super-chip stack
Y Ohara, A Noriki, K Sakuma, KW Lee, M Murugesan, J Bea, F Yamada, ...
2009 IEEE International Conference on 3D System Integration, 1-6, 2009
532009
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack
K Matsumoto, S Ibaraki, K Sueoka, K Sakuma, H Kikuchi, Y Orii, ...
2011 27th Annual IEEE Semiconductor Thermal Measurement and Managementá…, 2011
50*2011
3D chip stacking with C4 technology
B Dang, SL Wright, PS Andry, EJ Sprogis, CK Tsang, MJ Interrante, ...
IBM Journal of Research and Development 52 (6), 599-609, 2008
472008
Liquid crystal display
K Sakuma, Y Sakaguchi
US Patent 6,937,233, 2005
422005
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
JU Knickerbocker, R Budd, B Dang, Q Chen, E Colgan, LW Hung, ...
2018 IEEE 68th electronic components and technology conference (ECTC), 1519-1528, 2018
322018
A new wafer scale chip-on-chip (W-CoC) packaging technology using adhesive injection method
H Kurino, KW Lee, K Sakuma, T Nakamura, M Koyanagi
Japanese journal of applied physics 38 (4S), 2406, 1999
311999
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
K Sakuma, K Tunga, B Webb, K Ramachandran, M Interrante, H Liu, ...
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 318-324, 2015
302015
Structure for establishing interconnects in packages using thin interposers
BV Fasano, MS Cranmer, RF Indyk, H Cox, K Sakuma, ED Perfecto
US Patent 10,002,835, 2018
292018
Investigations of cooling solutions for three-dimensional (3D) chip stacks
K Matsumoto, S Ibaraki, M Sato, K Sakuma, Y Orii, F Yamada
2010 26th Annual IEEE Semiconductor Thermal Measurement and Managementá…, 2010
292010
Development of vacuum underfill technology for a 3D chip stack
K Sakuma, S Kohara, K Sueoka, Y Orii, M Kawakami, K Asai, Y Hirayama, ...
Journal of Micromechanics and Microengineering 21 (3), 035024, 2011
272011
The system can't perform the operation now. Try again later.
Articles 1–20