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Doosan Back
Doosan Back
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Title
Cited by
Cited by
Year
A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics
KP Drummond, D Back, MD Sinanis, DB Janes, D Peroulis, JA Weibel, ...
International Journal of Heat and Mass Transfer 117, 319-330, 2018
2772018
Characterization of hierarchical manifold microchannel heat sink arrays under simultaneous background and hotspot heating conditions
KP Drummond, D Back, MD Sinanis, DB Janes, D Peroulis, JA Weibel, ...
International Journal of Heat and Mass Transfer 126, 1289-1301, 2018
1092018
Evaporative intrachip hotspot cooling with a hierarchical manifold microchannel heat sink array
KP Drummond, JA Weibel, SV Garimella, D Back, DB Janes, MD Sinanis, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
642016
Single-layer graphene as a barrier layer for intense UV laser-induced damages for silver nanowire network
SR Das, Q Nian, M Saei, S Jin, D Back, P Kumar, DB Janes, MA Alam, ...
ACS nano 9 (11), 11121-11133, 2015
612015
Design, fabrication, and characterization of a compact hierarchical manifold microchannel heat sink array for two-phase cooling
D Back, KP Drummond, MD Sinanis, JA Weibel, SV Garimella, D Peroulis, ...
IEEE transactions on components, packaging and manufacturing technology 9 (7 …, 2019
462019
Development of interdigitated capacitive sensor for real-time monitoring of sub-micron and nanoscale particulate matters in personal sampling device for mining environment
D Back, D Theisen, W Seo, CSJ Tsai, DB Janes
IEEE Sensors Journal 20 (19), 11588-11597, 2020
42020
Optical characteristics of vertically aligned arrays of branched silver nanowires
A Mohammad, D Back, J Fang, A Kildishev, DB Janes
14th IEEE international conference on nanotechnology, 563-566, 2014
32014
SEMICONDUCTOR MEMORY DEVICE
DO Kim, GH Kil, JH Han, DS Back
US Patent App. 18/403,817, 2024
2024
Semiconductor device
D Back, KIM Dongoh, G Kil, JH Han
US Patent App. 18/496,336, 2024
2024
Semiconductor device
D Back, KIM Dongoh, G Kil, JH Han
US Patent 11,843,039, 2023
2023
Semiconductor devices
KIM Dongoh, G Kil, HAN Junghoon, D Back
US Patent App. 18/220,327, 2023
2023
Semiconductor devices
KIM Dongoh, G Kil, HAN Junghoon, D Back
US Patent App. 18/220,323, 2023
2023
Semiconductor memory device
KIM Dongoh, G Kil, HAN Junghoon, D Back
US Patent 11,792,976, 2023
2023
Semiconductor devices
KIM Dongoh, G Kil, HAN Junghoon, D Back
US Patent 11,758,713, 2023
2023
Semiconductor devices having cell array and peripheral regions therein
J Ju, G Kil, C Hyebin, D Back, A Choi, JH Han
US Patent App. 18/049,061, 2023
2023
Semiconductor devices having spacer structures
J Lee, G Kil, D Back, C Yoon, HAN Junghoon
US Patent App. 18/072,784, 2023
2023
Interdigitated capacitive sensor for real-time monitoring of sub-micron and nanoscale particulate matters
SJC Tsai, D Back, DB Janes
US Patent 11,650,144, 2023
2023
Semiconductor devices
C Hyebin, C Yoon, G Kil, D Back, CHO Hyungki, HAN Junghoon
US Patent App. 17/750,723, 2023
2023
Semiconductor device and method of fabricating the same
J Ju, CS Yoon, G Kil, D Back, JH Han
US Patent App. 17/862,987, 2023
2023
Semiconductor device
D Back, KIM Dongoh, G Kil, JH Han
US Patent 11,545,554, 2023
2023
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