| Optical printed circuit board and optical interconnection block using optical fiber bundle MH Cho, HS Cho, HH Park, JH Lee, KR Kim US Patent 7,136,551, 2006 | 108 | 2006 |
| Effect of dihedral angle on the morphology of grains in a matrix phase HH Park, DN Yoon Metallurgical Transactions A 16, 923-928, 1985 | 108 | 1985 |
| Pore filling process in liquid phase sintering HH Park, SJ Cho, DN Yoon Metallurgical and Materials Transactions A 15, 1075-1080, 1984 | 104 | 1984 |
| PCB-compatible optical interconnection using 45-ended connection rods and via-holed waveguides BS Rho, S Kang, HS Cho, HH Park, SW Ha Journal of lightwave technology 22 (9), 2128, 2004 | 101 | 2004 |
| Silicon-Based Optical Phased Array Using Electro-Optic - - Phase Shifters G Kang, SH Kim, JB You, DS Lee, H Yoon, YG Ha, JH Kim, DE Yoo, ... IEEE Photonics Technology Letters 31 (21), 1685-1688, 2019 | 69 | 2019 |
| Wideband receiver for a three-dimensional ranging LADAR system TH Ngo, CH Kim, YJ Kwon, JS Ko, DB Kim, HH Park IEEE Transactions on Circuits and Systems I: Regular Papers 60 (2), 448-456, 2012 | 67 | 2012 |
| 32 Gbps data transmission with 2D beam-steering using a silicon optical phased array HW Rhee, JB You, H Yoon, K Han, M Kim, BG Lee, SC Kim, HH Park IEEE Photonics Technology Letters 32 (13), 803-806, 2020 | 66 | 2020 |
| Optical backplane system using waveguide-embedded PCBs and optical slots KB Yoon, IK Cho, SH Ahn, MY Jeong, DJ Lee, YU Heo, BS Rho, HH Park, ... Journal of lightwave technology 22 (9), 2119-2127, 2004 | 62 | 2004 |
| Packaging apparatus for optical interconnection on optical printed circuit board DS Kim, HH Park, HS Cho, BS Rho, S Jung US Patent 7,239,767, 2007 | 57 | 2007 |
| The critical grain size for liquid flow into pores during liquid phase sintering HH Park, OJ Kwon, DN Yoon Metallurgical Transactions A 17, 1915-1919, 1986 | 57 | 1986 |
| High-coupling-efficiency optical interconnection using a 90/spl deg/-bent fiber array connector in optical printed circuit boards MH Cho, SH Hwang, HS Cho, HH Park IEEE Photonics Technology Letters 17 (3), 690-692, 2005 | 56 | 2005 |
| New pump wavelength of 1540-nm band for long-wavelength-band erbium-doped fiber amplifier (L-band EDFA) BH Choi, HH Park, MJ Chu IEEE Journal of Quantum Electronics 39 (10), 1272-1280, 2003 | 55 | 2003 |
| Polarization control of vertical-cavity surface-emitting lasers by electro-optic birefringence MS Park, BT Ahn, BS Yoo, HY Chu, HH Park, CJ Chang-Hasnain Applied Physics Letters 76 (7), 813-815, 2000 | 55 | 2000 |
| High-gain coefficient long-wavelength-band erbium-doped fiber amplifier using 1530-nm band pump BH Choi, HH Park, M Chu, SK Kim IEEE Photonics Technology Letters 13 (2), 109-111, 2001 | 54 | 2001 |
| Passively assembled optical interconnection system based on an optical printed-circuit board SH Hwang, MH Cho, SK Kang, HH Park, HS Cho, SH Kim, KU Shin, ... IEEE photonics technology letters 18 (5), 652-654, 2006 | 49 | 2006 |
| Thermo-optic control of the longitudinal radiation angle in a silicon-based optical phased array SH Kim, JB You, YG Ha, G Kang, DS Lee, H Yoon, DE Yoo, DW Lee, K Yu, ... Optics Letters 44 (2), 411-414, 2019 | 48 | 2019 |
| An analysis of the surface menisci in a mixture of liquid and deformable grains HH Park, SJL Kang, DN Yoon Metallurgical Transactions A 17, 325-330, 1986 | 48 | 1986 |
| Two-dimensional optical interconnection based on two-layered optical printed circuit board SH Hwang, MH Cho, SK Kang, TW Lee, HH Park, BS Rho IEEE Photonics Technology Letters 19 (6), 411-413, 2007 | 46 | 2007 |
| Compact packaging of optical and electronic components for on-board optical interconnects HS Cho, KM Chu, S Kang, SH Hwang, BS Rho, WH Kim, JS Kim, JJ Kim, ... IEEE Transactions on Advanced Packaging 28 (1), 114-120, 2005 | 42 | 2005 |
| Fabrication method of polarization-controlled surface-emitting laser diode using tilted-cavity HY Chu, BS Yoo, HH Park, MS Park US Patent 5,712,188, 1998 | 38 | 1998 |
