עקוב אחר
Jean-Pierre Raskin
Jean-Pierre Raskin
Université catholique de Louvain, Engineering School of Louvain
כתובת אימייל מאומתת בדומיין uclouvain.be
כותרת
צוטט על ידי
צוטט על ידי
שנה
Substrate crosstalk reduction using SOI technology
JP Raskin, A Viviani, D Flandre, JP Colinge
IEEE Transactions on electron devices 44 (12), 2252-2261, 1997
4071997
New substrate passivation method dedicated to HR SOI wafer fabrication with increased substrate resistivity
D Lederer, JP Raskin
IEEE Electron Device Letters 26 (11), 805-807, 2005
2902005
Low temperature implementation of dopant-segregated band-edge metallic S/D junctions in thin-body SOI p-MOSFETs
G Larrieu, E Dubois, R Valentin, N Breil, F Danneville, G Dambrine, ...
2007 IEEE International Electron Devices Meeting, 147-150, 2007
2792007
Arsenic-segregated rare-earth silicide junctions: reduction of Schottky barrier and integration in metallic n-MOSFETs on SOI
G Larrieu, DA Yarekha, E Dubois, N Breil, O Faynot
IEEE Electron Device Letters 30 (12), 1266-1268, 2009
2672009
Raman and XPS characterization of vanadium oxide thin films with temperature
F Ureña-Begara, A Crunteanu, JP Raskin
Applied Surface Science 403, 717-727, 2017
2662017
Influence of device engineering on the analog and RF performances of SOI MOSFETs
V Kilchytska, A Neve, L Vancaillie, D Levacq, S Adriaensen, H van Meer, ...
IEEE Transactions on Electron Devices 50 (3), 577-588, 2003
2662003
Fabrication method of so1 semiconductor devices
D Fladre, A De Mevergnies, JP Raskins
US Patent App. 10/471,847, 2004
2532004
Identification of RF harmonic distortion on Si substrates and its reduction using a trap-rich layer
DC Kerr, JM Gering, TG McKay, MS Carroll, CR Neve, JP Raskin
2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF …, 2008
1842008
Fully-depleted SOI CMOS for analog applications
JP Colinge
IEEE Transactions on Electron Devices 45 (5), 1010-1016, 1998
1751998
Semiconductor-on-insulator materials for nanoelectronics applications
A Nazarov, JP Colinge, F Balestra, JP Raskin, F Gamiz, VS Lysenko
Springer Berlin Heidelberg, 2011
1682011
A 94-GHz aperture-coupled micromachined microstrip antenna
GP Gauthier, JP Raskin, LPB Katehi, GM Rebeiz
IEEE Transactions on Antennas and Propagation 47 (12), 1761-1766, 1999
1681999
Substrate loss mechanisms for microstrip and CPW transmission lines on lossy silicon wafers
D Lederer, JP Raskin
Solid-State Electronics 47 (11), 1927-1936, 2003
1642003
Low-temperature wafer bonding: a study of void formation and influence on bonding strength
XX Zhang, JP Raskin
Journal of microelectromechanical systems 14 (2), 368-382, 2005
1582005
Inter-and intragranular plasticity mechanisms in ultrafine-grained Al thin films: An in situ TEM study
F Mompiou, M Legros, A Boé, M Coulombier, JP Raskin, T Pardoen
Acta materialia 61 (1), 205-216, 2013
1482013
Accurate SOI MOSFET characterization at microwave frequencies for device performance optimization and analog modeling
JP Raskin, R Gillon, J Chen, D Vanhoenacker-Janvier, JP Colinge
IEEE Transactions on Electron Devices 45 (5), 1017-1025, 1998
1481998
Junctionless transistors: physics and properties
JP Colinge, CW Lee, N Dehdashti Akhavan, R Yan, I Ferain, P Razavi, ...
Semiconductor-on-insulator materials for nanoelectronics applications, 187-200, 2011
1462011
Micromachined thin-film sensors for SOI-CMOS co-integration
J Laconte, D Flandre, JP Raskin
Springer Science & Business Media, 2006
1462006
Comparison of TiSi2, CoSi2, and NiSi for thin‐film silicon‐on‐insulator applications
J Chen, JP Colinge, D Flandre, R Gillon, JP Raskin, D Vanhoenacker
Journal of the Electrochemical Society 144 (7), 2437, 1997
1421997
Analog/RF performance of multiple gate SOI devices: wideband simulations and characterization
JP Raskin, TM Chung, V Kilchytska, D Lederer, D Flandre
IEEE Transactions on Electron Devices 53 (5), 1088-1095, 2006
1372006
New on-chip nanomechanical testing laboratory-applications to aluminum and polysilicon thin films
S Gravier, M Coulombier, A Safi, N André, A Boé, JP Raskin, T Pardoen
Journal of microelectromechanical systems 18 (3), 555-569, 2009
1322009
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מאמרים 1–20