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Zlatan AksamijaAssociate Professor, Materials Science and Engineering, University of UtahVerified email at utah.edu
Edwin Bosco RamayyaThermo Mechanical Modeling Group, Intel CorporationVerified email at intel.com
Susan C. HagnessPhilip D Reed Professor and Chair of Electrical and Computer Engineering, UW-MadisonVerified email at engr.wisc.edu
Dragica VasileskaArizona State UniversityVerified email at asu.edu
D. BotezPhilip Dunham Reed Professor, University of Wisconsin-MadisonVerified email at engr.wisc.edu
Song MeiUniversity of Wisconsin MadisonVerified email at wisc.edu
Amirhossein DavoodyIntel Inc.Verified email at intel.com
Farhad KarimiMicrosoft Station Q at Santa BarbaraVerified email at microsoft.com
Leon N MaurerVerified email at wisc.edu
Mark A. ErikssonJohn Bardeen Professor and Steenbock Professor of Physical Sciences, University of Wisconsin-MadisonVerified email at wisc.edu
DONALD SAVAGEUniversity of WisconsinVerified email at wisc.edu
Paul EvansProfessor, Materials Science and Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
George K CellerProfessor of Materials Science, Rutgers UniversityVerified email at rci.rutgers.edu
Yanbing ShiUniversity of Wisconsin-MadisonVerified email at wisc.edu
Weina PengUniversity of Texas at DallasVerified email at utdallas.edu
Benjamin B. YangGeorgia Tech Research InstituteVerified email at gatech.edu
Eric PopPease-Ye Professor of Electrical Engineering, MSE, AP at Stanford & SLACVerified email at stanford.edu
LUKE MAWSTUniversity of WisconsinVerified email at wisc.edu
Feng LiuProfessor, Department of Materials Science and Engineering, University of UtahVerified email at eng.utah.edu
Michael S. ArnoldUniversity of Wisconsin-MadisonVerified email at wisc.edu
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Irena Knezevic
Professor, Electrical and Computer Engineering, University of Wisconsin - Madison
Verified email at engr.wisc.edu - Homepage