| Physical simulation of environmentally induced thin shell deformation HY Chen, A Sastry, WM van Rees, E Vouga ACM Transactions on Graphics (TOG) 37 (4), 1-13, 2018 | 37 | 2018 |
| Cosputtered Cu/Ti bonded interconnects with a self-formed adhesion layer for three-dimensional integration applications SY Hsu, HY Chen, KN Chen IEEE electron device letters 33 (7), 1048-1050, 2012 | 21 | 2012 |
| Fine wrinkling on coarsely meshed thin shells Z Chen, HY Chen, DM Kaufman, M Skouras, E Vouga ACM Transactions on Graphics (TOG) 40 (5), 1-32, 2021 | 15 | 2021 |
| Electrical performance and reliability investigation of cosputtered Cu/Ti bonded interconnects HY Chen, SY Hsu, KN Chen IEEE transactions on electron devices 60 (10), 3521-3526, 2013 | 13 | 2013 |
| Real-time obstructive sleep apnea detection based on ECG derived respiration signal T Huang, HY Chen, WC Fang 2012 IEEE International Symposium on Circuits and Systems (ISCAS), 341-344, 2012 | 10 | 2012 |
| Diffxpbd: Differentiable position-based simulation of compliant constraint dynamics T Stuyck, H Chen Proceedings of the ACM on Computer Graphics and Interactive Techniques 6 (3 …, 2023 | 5 | 2023 |
| DiffAvatar: Simulation-Ready Garment Optimization with Differentiable Simulation Y Li, H Chen, E Larionov, N Sarafianos, W Matusik, T Stuyck arXiv preprint arXiv:2311.12194, 2023 | 2 | 2023 |
| Locking-free Simulation of Isometric Thin Plates H Chen, P Kry, E Vouga arXiv preprint arXiv:1911.05204, 2019 | 2 | 2019 |
| Estimating Cloth Elasticity Parameters From Homogenized Yarn-Level Models JX Zhang, GWC Lin, L Bode, H Chen, T Stuyck, E Larionov arXiv preprint arXiv:2401.15169, 2024 | 1 | 2024 |
| Estimating Cloth Elasticity Parameters From Homogenized Yarn-Level Models J Xiaoji Zhang, G Wei-Chin Lin, L Bode, H Chen, T Stuyck, E Larionov arXiv e-prints, arXiv: 2401.15169, 2024 | | 2024 |
