A fast loss and temperature simulation method for power converters, part II: 3-D thermal model of power module I Swan, A Bryant, PA Mawby, T Ueta, T Nishijima, K Hamada Power Electronics, IEEE Transactions on 27 (1), 258-268, 2012 | 97 | 2012 |
A fast loss and temperature simulation method for power converters, Part I: Electrothermal modeling and validation A Bryant, NA Parker-Allotey, D Hamilton, I Swan, PA Mawby, T Ueta, ... IEEE transactions on power electronics 27 (1-2), 248-257, 2012 | 77 | 2012 |
3-D thermal simulation of power module packaging IR Swan, AT Bryant, NA Parker-Allotey, PA Mawby Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE, 1247-1254, 2009 | 26 | 2009 |
Fast thermal models for power device packaging IR Swan, AT Bryant, PA Mawby Industry Applications Society Annual Meeting, 2008. IAS'08. IEEE, 1-8, 2008 | 25 | 2008 |
Fast 3D thermal simulation of power module packaging IR Swan, AT Bryant, PA Mawby International Journal of Numerical Modelling: Electronic Networks, Devices …, 2012 | 8 | 2012 |
Validation of a fast loss and temperature simulation method for power converters AT Bryant, NA Parker-Allotey, IR Swan, DP Hamilton, PA Mawby, T Ueta, ... ETG-Fachbericht-CIPS 2010, 2010 | 8 | 2010 |
3-D thermal modelling of power device packaging IR Swan University of Warwick, 2010 | 4 | 2010 |