| Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue L Yin, L Wentlent, L Yang, B Arfaei, A Qasaimeh, P Borgesen Journal of Electronic Materials 41 (2), 241-252, 2012 | 159 | 2012 |
| On the root cause of Kirkendall voiding in Cu3Sn L Yin, P Borgesen Journal of Materials Research 26 (3), 455-466, 2011 | 118 | 2011 |
| Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface: Plating in acidic copper solution with and without … Y Liu, J Wang, L Yin, P Kondos, C Parks, P Borgesen, DW Henderson, ... Journal of applied electrochemistry 38, 1695-1705, 2008 | 93 | 2008 |
| Dissolutive wetting in the Bi–Sn system L Yin, BT Murray, TJ Singler Acta materialia 54 (13), 3561-3574, 2006 | 92 | 2006 |
| Wetting in the Au–Sn system L Yin, SJ Meschter, TJ Singler Acta Materialia 52 (10), 2873-2888, 2004 | 80 | 2004 |
| Reactive wetting in metal/metal systems: dissolutive versus compound-forming systems L Yin, A Chauhan, TJ Singler Materials Science and Engineering: A 495 (1-2), 80-89, 2008 | 57 | 2008 |
| A mechanistic thermal fatigue model for SnAgCu solder joints P Borgesen, L Wentlent, S Hamasha, S Khasawneh, S Shirazi, D Schmitz, ... Journal of Electronic Materials 47, 2526-2544, 2018 | 56 | 2018 |
| Reactive wetting in metal–metal systems L Yin, BT Murray, S Su, Y Sun, Y Efraim, H Taitelbaum, TJ Singler Journal of Physics: Condensed Matter 21 (46), 464130, 2009 | 50 | 2009 |
| Assessing the risk of “Kirkendall voiding” in Cu3Sn P Borgesen, L Yin, P Kondos Microelectronics Reliability 51 (4), 837-846, 2011 | 49 | 2011 |
| Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding L Yin, F Wafula, N Dimitrov, P Borgesen Journal of electronic materials 41, 302-312, 2012 | 47 | 2012 |
| Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion V Venkatadri, L Yin, Y Xing, E Cotts, K Srihari, P Borgesen 2009 59th Electronic Components and Technology Conference, 398-405, 2009 | 47 | 2009 |
| Sporadic degradation in board level drop reliability-those aren't all kirkendall voids! P Borgesen, L Yin, P Kondos, DW Henderson, G Servis, J Therriault, ... 2007 Proceedings 57th Electronic Components and Technology Conference, 136-146, 2007 | 47 | 2007 |
| Uniform corrosion of FeCrAl cladding tubing for accident tolerant fuels in light water reactors L Yin, TB Jurewicz, M Larsen, M Drobnjak, CC Graff, DR Lutz, RB Rebak Journal of Nuclear Materials 554, 153090, 2021 | 44 | 2021 |
| Silicon carbide integrated circuits with stable operation over a wide temperature range R Ghandi, CP Chen, L Yin, X Zhu, L Yu, S Arthur, F Ahmad, P Sandvik IEEE Electron Device Letters 35 (12), 1206-1208, 2014 | 44 | 2014 |
| Silicon carbide integrated circuits for extreme environments AS Kashyap, CP Chen, R Ghandi, A Patil, E Andarawis, L Yin, ... The 1st IEEE workshop on wide bandgap power devices and applications, 60-63, 2013 | 44 | 2013 |
| Improving copper electrodeposition in the microelectronics industry Y Liu, L Yin, S Bliznakov, P Kondos, P Borgesen, DW Henderson, C Parks, ... IEEE Transactions on Components and Packaging Technologies 33 (1), 127-137, 2009 | 44 | 2009 |
| Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure B Arfaei, L Wentlent, S Joshi, A Alazzam, T Tashtoush, M Halaweh, ... 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 43 | 2012 |
| Modeling and experiments in dissolutive wetting: a review TJ Singler, S Su, L Yin, BT Murray Journal of Materials Science 47 (24), 8261-8274, 2012 | 40 | 2012 |
| Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper F Wafula, Y Liu, L Yin, S Bliznakov, P Borgesen, EJ Cotts, N Dimitrov Journal of The Electrochemical Society 157 (2), D111, 2009 | 38 | 2009 |
| Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell F Wafula, Y Liu, L Yin, P Borgesen, EJ Cotts, N Dimitrov Journal of applied electrochemistry 41, 469-480, 2011 | 32 | 2011 |
Peter BorgesenProfessor of Systems Science & Industrial Engineering, Binghamton Universityכתובת אימייל מאומתת בדומיין binghamton.edu
