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Amit Kohn
Amit Kohn
Department of Materials Science and Engineering, Tel Aviv University
Verified email at tauex.tau.ac.il - Homepage
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Cited by
Year
Characterization of electroless deposited Co (W, P) thin films for encapsulation of copper metallization
A Kohn, M Eizenberg, Y Shacham-Diamand, Y Sverdlov
Materials Science and Engineering: A 302 (1), 18-25, 2001
1652001
The antiferromagnetic structures of IrMn3 and their influence on exchange-bias
A Kohn, A Kovács, R Fan, GJ McIntyre, RCC Ward, JP Goff
Scientific Reports 3, 2013
1562013
Electrodeposition of ceramic films from non-aqueous and mixed solutions
I Zhitomirsky, L Gal-Or, A Kohn, HW Hennicke
Journal of Materials Science 30 (20), 5307-5312, 1995
1481995
Microelectronic packaging, Chapter 3: “Electroless barrier and seed layers for on-chip metallization”
M Editors: Datta, T Osaka, JW Schultze, ...
New Trends in Electrochemical Technology CRC press ISBN: 041531190X, 2005 3 …, 2004
122*2004
Advanced nanoscale ULSI interconnects: fundamentals and applications, Chapter: “Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization“
Y Editors: Shacham-Diamand, T Osaka, M Datta, T Ohba, ...
in "Frontier of Electrochemical Nano-Science and Nano-Technology", Springer …, 2009
96*2009
Evidence for FeO formation at the Fe/MgO interface in epitaxial TMR structure by X-ray photoelectron spectroscopy
SG Wang, G Han, GH Yu, Y Jiang, C Wang, A Kohn, RCC Ward
Journal of Magnetism and Magnetic Materials 310 (2), 1935-1936, 2007
952007
Evaluation of electroless deposited Co (W, P) thin films as diffusion barriers for copper metallization
A Kohn, M Eizenberg, Y Shacham-Diamand, B Israel, Y Sverdlov
Microelectronic engineering 55 (1-4), 297-303, 2001
922001
Structures of ultra-thin atomic-layer-deposited TaNx films
YY Wu, A Kohn, M Eizenberg
Journal of Applied Physics 95 (11), 6167-6174, 2004
832004
Temperature dependence of giant tunnel magnetoresistance in epitaxial Fe/MgO/Fe magnetic tunnel junctions
SG Wang, RCC Ward, GX Du, XF Han, C Wang, A Kohn
Physical Review B 78 (18), 180411, 2008
772008
Electrochemical preparation of PbO films
I Zhitomirsky, L Gal-Or, A Kohn, HW Hennicke
Journal of Materials Science Letters 14 (11), 807-810, 1995
531995
Electrolytic PZT films
I Zhitomirsky, L Gal-Or, A Kohn, M D SPANG
Journal of Materials Science 32 (3), 803-807, 1997
511997
Temperature dependence of resistance in epitaxial Fe/MgO/Fe magnetic tunnel junctions
QL Ma, SG Wang, J Zhang, Y Wang, RCC Ward, C Wang, A Kohn, ...
Applied Physics Letters 95 (5), 052506, 2009
492009
Spin-dependent tunneling spectroscopy for interface characterization of epitaxial Fe/MgO/Fe magnetic tunnel junctions
GX Du, SG Wang, QL Ma, Y Wang, RCC Ward, XG Zhang, C Wang, ...
Physical Review B 81 (6), 064438, 2010
482010
Copper grain boundary diffusion in electroless deposited cobalt based films and its influence on diffusion barrier integrity for copper metallization
A Kohn, M Eizenberg, Y Shacham-Diamand
Journal of Applied Physics 94 (5), 3015-3024, 2003
462003
Characterization of embedded MgO/ferromagnet contacts for spin injection in silicon
T Uhrmann, T Dimopoulos, H Brückl, VK Lazarov, A Kohn, U Paschen, ...
Journal of Applied Physics 103 (6), 2008
452008
Interface effects in highly oriented films of the Heusler alloy Co2MnSi on GaAs (001)
LJ Singh, ZH Barber, A Kohn, AK Petford-Long, Y Miyoshi, Y Bugoslavsky, ...
Journal of Applied Physics 99 (1), 013904, 2006
442006
Structural study of amorphous CoFeB thin films exhibiting in-plane uniaxial magnetic anisotropy
D Kirk, A Kohn, KB Borisenko, C Lang, J Schmalhorst, G Reiss, ...
Physical Review B 79 (1), 014203, 2009
432009
The role of microstructure in nanocrystalline conformal Co 0.9 W 0.02 P 0.08 diffusion barriers for copper metallization
A Kohn, M Eizenberg, Y Shacham-Diamand
Applied Surface Science 212, 367-372, 2003
402003
Parallel p–n junctions across nanowires by one-step ex situ doping
O Hazut, BC Huang, A Pantzer, I Amit, Y Rosenwaks, A Kohn, CS Chang, ...
ACS Nano 8 (8), 8357-8362, 2014
362014
Improved diffusion barriers for copper metallization obtained by passivation of grain boundaries in electroless deposited cobalt-based films
A Kohn, M Eizenberg, Y Shacham-Diamand
Journal of Applied Physics 92 (9), 5508-5511, 2002
352002
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