Stress evolution due to electromigration in confined metal lines MA Korhonen, P Borgesen, KN Tu, CY Li Journal of Applied Physics 73 (8), 3790-3799, 1993 | 876 | 1993 |
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder LP Lehman, SN Athavale, TZ Fullem, AC Giamis, RK Kinyanjui, ... Journal of Electronic Materials 33, 1429-1439, 2004 | 209 | 2004 |
Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses MA Korhonen, P Borgesen, DD Brown, CY Li Journal of applied physics 74 (8), 4995-5004, 1993 | 193 | 1993 |
Classifying the dimensional variation in additive manufactured parts from laser-scanned three-dimensional point cloud data using machine learning approaches M Samie Tootooni, A Dsouza, R Donovan, PK Rao, Z Kong, P Borgesen Journal of Manufacturing Science and Engineering 139 (9), 091005, 2017 | 170 | 2017 |
Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue L Yin, L Wentlent, LL Yang, B Arfaei, A Oasaimeh, P Borgesen Journal of electronic materials 41, 241-252, 2012 | 160 | 2012 |
The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure A Zribi, A Clark, L Zavalij, P Borgesen, EJ Cotts Journal of Electronic Materials 30, 1157-1164, 2001 | 153 | 2001 |
On the root cause of Kirkendall voiding in Cu3Sn L Yin, P Borgesen Journal of Materials Research 26 (3), 455-466, 2011 | 119 | 2011 |
Computational fluid dynamics modeling and online monitoring of aerosol jet printing process R Salary, JP Lombardi, M Samie Tootooni, R Donovan, PK Rao, ... Journal of Manufacturing Science and Engineering 139 (2), 021015, 2017 | 117 | 2017 |
Interconnect structures containing blocked segments to minimize stress migration and electromigration damage CY Li, P Borgesen, MA Korhonen US Patent 5,439,731, 1995 | 100 | 1995 |
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface: Plating in acidic copper solution with and without … Y Liu, J Wang, L Yin, P Kondos, C Parks, P Borgesen, DW Henderson, ... Journal of applied electrochemistry 38, 1695-1705, 2008 | 93 | 2008 |
Thermal-stress-induced voiding in narrow, passivated Cu lines P Børgesen, JK Lee, R Gleixner, CY Li Applied physics letters 60 (14), 1706-1708, 1992 | 82 | 1992 |
Beam-Solid Interactions: Physical Phenomena JA Knapp, P Børgesen, RA Zuhr Materials Research Society Symposium Proceedings 157, 1990 | 71* | 1990 |
Pb-free solder: New materials considerations for microelectronics processing P Borgesen, T Bieler, LP Lehman, EJ Cotts MRS bulletin 32 (4), 360-365, 2007 | 70 | 2007 |
Depth profiling by ion-beam spectrometry P Borgesen, R Behrisch, BMU Scherzer Applied Physics A 27 (4), 183-195, 1982 | 70 | 1982 |
The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints B Arfaei, Y Xing, J Woods, J Wolcott, P Tumne, P Borgesen, E Cotts 2008 58th Electronic Components and Technology Conference, 459-465, 2008 | 68 | 2008 |
Do thermal spikes contribute to the ion‐induced mixing of Ni into Zr, Ti, and Pd? P Borgesen, DA Lilienfeld, HH Johnson Applied Physics Letters 57 (14), 1407-1409, 1990 | 68 | 1990 |
Assessment of solder joint fatigue life under realistic service conditions S Hamasha, Y Jaradat, A Qasaimeh, M Obaidat, P Borgesen Journal of Electronic Materials 43 (12), 4472-4484, 2014 | 64 | 2014 |
Stress‐migration related electromigration damage mechanism in passivated, narrow interconnects CY Li, P Borgesen, TD Sullivan Applied physics letters 59 (12), 1464-1466, 1991 | 62 | 1991 |
Solder joint reliability under realistic service conditions P Borgesen, S Hamasha, M Obaidat, V Raghavan, X Dai, M Meilunas, ... Microelectronics Reliability 53 (9-11), 1587-1591, 2013 | 61 | 2013 |
Stress‐induced nucleation of voids in narrow aluminum‐based metallizations on silicon substrates MA Korhonen, WR LaFontaine, P Borgesen, CY Li Journal of applied physics 70 (11), 6774-6781, 1991 | 58 | 1991 |