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Co-authors
Joanna AizenbergHarvard UniversityVerified email at seas.harvard.edu
Tak-Sing WongWormley Family Early Career Professor, The Pennsylvania State UniversityVerified email at psu.edu
Katia BertoldiSEAS, Harvard UniversityVerified email at seas.harvard.edu
Dr. Sicong ShanSchool of Engineering and Applied Sciences (SEAS), Harvard UniversityVerified email at seas.harvard.edu
Lichen FangDepartment of Mechanical Engineering, Johns Hopkins UniversityVerified email at jhu.edu
Philseok KimHarvard UniversityVerified email at seas.harvard.edu
Pai WangUniversity of Utah; Harvard UniversityVerified email at seas.harvard.edu
Krishna C MandalDepartment of Electrical Engineering, University of South Carolina, Columbia, SC 29208, USAVerified email at cec.sc.edu
Boaz PokroyTechnion Israel Institute of TechnologyVerified email at tx.technion.ac.il
Sindy KY TangAssociate Professor, Mechanical Engineering, Stanford UniversityVerified email at stanford.edu
L MahadevanHarvard, Cambridge, MITVerified email at seas.harvard.edu
Santiago Orrego, Ph.D.Assistant Professor, Temple UniversityVerified email at temple.edu
James C. WeaverSchool of Engineering and Applied Sciences, Harvard UniversityVerified email at seas.harvard.edu
Vladimir BulovicMassachusetts Institute of TechnologyVerified email at mit.edu
Jordan R. RaneyUniversity of PennsylvaniaVerified email at seas.upenn.edu
Jennifer A. LewisHarvard UniversityVerified email at seas.harvard.edu
Samuel ShianResearch Associate in Materials Science and Mechanical Engineering, Harvard UniversityVerified email at seas.harvard.edu
Andrej KošmrljAssistant Professor, Princeton UniversityVerified email at princeton.edu
Mikhail KatsAssociate Professor of Electrical and Computer Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
Darren J. LipomiDepartment of NanoEngineering, UC San DiegoVerified email at ucsd.edu
Sung Hoon Kang
Assistant Professor, Mechanical Engineering, Johns Hopkins University
Verified email at jhu.edu - Homepage