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Satish Chaparala
Satish Chaparala
Product Quality and Reliability Engineer, Applied Materials
Verified email at AMAT.com
Title
Cited by
Cited by
Year
Mechanical shock testing and modeling of PC motherboards
J Pitarresi, B Roggeman, S Chaparala, P Geng
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
962004
Room Temperature CW Operation of Short Wavelength Quantum Cascade Lasers Made of Strain Balanced Ga $ _ {\bm x} $ In $ _ {\bm {1-x}} $ As/Al $ _ {\bm y} $ In $ _ {\bm {1-y …
F Xie, C Caneau, HP LeBlanc, NJ Visovsky, SC Chaparala, ...
IEEE Journal of Selected Topics in Quantum Electronics 17 (5), 1445-1452, 2011
482011
Effect of geometry and temperature cycle on the reliability of WLCSP solder joints
SC Chaparala, BD Roggeman, JM Pitarresi, BG Sammakia, J Jackson, ...
IEEE transactions on components and packaging technologies 28 (3), 441-448, 2005
412005
Fabrication of 3D-IC interposers
J Keech, S Chaparala, A Shorey, G Piech, S Pollard
2013 IEEE 63rd Electronic Components and Technology Conference, 1829-1833, 2013
292013
Methods and apparatus for providing an interposer for interconnecting semiconductor chips
SC Chaparala, SC Pollard
US Patent 9,472,479, 2016
252016
63.2: Distinguished Paper: Efficient and Compact Green Laser Incorporating Adaptive Optics for Wide Operating Temperature Range
V Bhatia, SJ Gregorski, D Pikula, SC Chaparala, DAS Loeber, J Gollier, ...
SID Symposium Digest of Technical Papers 39 (1), 962-965, 2008
212008
Efficient and compact green laser for micro‐projector applications
V Bhatia, SJ Gregorski, D Pikula, SC Chaparala, DAS Loeber, J Gollier, ...
Journal of the Society for Information Display 17 (3), 271-277, 2009
202009
Dynamic analysis of thin glass under ball drop impact with new metrics
L Xue, CR Coble, H Lee, D Yu, S Chaparala, S Park
ASME 2013 International Technical Conference and Exhibition on Packaging and …, 2013
192013
Design guidelines for efficient thermal management of mid-infrared quantum cascade lasers
SC Chaparala, F Xie, C Caneau, CE Zah, LC Hughes
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011
152011
Nanolubrication of sliding components in adaptive optics used in microprojectors
B Bhushan, H Lee, SC Chaparala, V Bhatia
Applied surface science 256 (24), 7545-7558, 2010
152010
Experimental and numerical investigation of the reliability of double-sided area array assemblies
S Chaparala, JM Pitarresi, S Parupalli, S Mandepudi, M Meilunas
142006
Miniature multiple-axes adaptive optics unit employing SIDMs and its application to an efficient green laser module
Y Ozeki, T Hata, K Shibatani, F Nagai, N Mori, Y Nakabayashi, N MITSUGI, ...
Konica Minolta Technology Report 6, 2009
132009
High power and high temperature continuous-wave operation of distributed Bragg reflector quantum cascade lasers
F Xie, CG Caneau, HP LeBlanc, M Ho, J Wang, S Chaparala, LC Hughes, ...
Applied Physics Letters 104 (7), 071109, 2014
122014
Edge bonded optical packages
VA Bhagavatula, SC Chaparala, J Himmelreich, LC Hughes Jr
US Patent 8,102,887, 2012
122012
A parametric solder joint reliability model for wafer level-chip scale package
J Pitarresi, S Chaparala, B Sammakia, L Nguyen, V Patwardhan, L Zhang, ...
52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002
122002
Reliability of 4.6-µm quantum cascade lasers under continuous-wave room-temperature operation
F Xie, CG Caneau, HP LeBlanc, CA Page, SC Chaparala, OD Deichmann, ...
Optical Engineering 49 (11), 111104, 2010
112010
Dynamics behavior of flat glass panels under impact conditions: Experiments and numerical modeling
S Chaparala, L Xue, D Yu, S Park
Journal of the Society for Information Display 23 (3), 97-106, 2015
92015
Methods for passively aligning opto-electronic component assemblies on substrates
VA Bhagavatula, SC Chaparala, J Himmelreich
US Patent 8,036,508, 2011
82011
Effect of dwell times and ramp rates on the thermal cycling reliability of Pb-free wafer-level chip scale packages: Experiments and modeling
S Chaparala, JM Pitarresi, M Meilunas
ASME 2006 International Mechanical Engineering Congress and Exposition, 59-65, 2006
82006
Methods and apparatus for providing an interposer for interconnecting semiconductor chips
SC Chaparala, SC Pollard
US Patent 9,917,045, 2018
72018
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