| On the relationship of high coercivity and ordered phase in CoPt and FePt thin films RA Ristau, K Barmak, LH Lewis, KR Coffey, JK Howard Journal of applied physics 86 (8), 4527-4533, 1999 | 380 | 1999 |
| On the relationship of magnetocrystalline anisotropy and stoichiometry in epitaxial CoPt (001) and FePt (001) thin films K Barmak, J Kim, LH Lewis, KR Coffey, MF Toney, AJ Kellock, JU Thiele Journal of Applied Physics 98 (3), 033904, 2005 | 222 | 2005 |
| Investigating the thermodynamics and kinetics of thin film reactions by differential scanning calorimetry C Michaelsen, K Barmak, TP Weihs JOURNAL OF PHYSICS-LONDON-D APPLIED PHYSICS 30, 3167-3186, 1997 | 222 | 1997 |
| The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin films LA Clevenger, A Mutscheller, JME Harper, C Cabral Jr, K Barmak Journal of Applied Physics 72 (10), 4918-4924, 1992 | 206 | 1992 |
| Surface and grain-boundary scattering in nanometric Cu films T Sun, B Yao, AP Warren, K Barmak, MF Toney, RE Peale, KR Coffey Physical Review B 81 (15), 155454, 2010 | 170 | 2010 |
| Experimental evidence for nucleation during thin‐film reactions KR Coffey, LA Clevenger, K Barmak, DA Rudman, CV Thompson Applied physics letters 55 (9), 852-854, 1989 | 147 | 1989 |
| Simulation of Hubbard model physics in WSe 2/WS 2 moiré superlattices Y Tang, L Li, T Li, Y Xu, S Liu, K Barmak, K Watanabe, T Taniguchi, ... Nature 579 (7799), 353-358, 2020 | 143 | 2020 |
| The early stages of solid‐state reactions in Ni/Al multilayer films C Michaelsen, G Lucadamo, K Barmak Journal of applied physics 80 (12), 6689-6698, 1996 | 132 | 1996 |
| Reactive phase formation in sputter-deposited Ni/Al multilayer thin films K Barmak, C Michaelsen, G Lucadamo Journal of Materials Research 12 (1), 133-146, 1997 | 128 | 1997 |
| On the use of alloying elements for Cu interconnect applications K Barmak, C Cabral Jr, KP Rodbell, JME Harper Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2006 | 122 | 2006 |
| Calorimetric studies of the to transformation in FePt and CoPt thin films K Barmak, J Kim, S Shell, EB Svedberg, JK Howard Applied physics letters 80 (22), 4268-4270, 2002 | 114 | 2002 |
| Igniting innovation: rethinking the role of government in emerging Europe and Central Asia I Goldberg, JG Goddard, S Kuriakose, JL Racine The World Bank, 2011 | 113* | 2011 |
| Dominant role of grain boundary scattering in the resistivity of nanometric Cu films T Sun, B Yao, AP Warren, K Barmak, MF Toney, RE Peale, KR Coffey Physical Review B 79 (4), 041402, 2009 | 109 | 2009 |
| Electrodeposited NiAl particle composite coatings DF Susan, K Barmak, AR Marder Thin Solid Films 307 (1-2), 133-140, 1997 | 100 | 1997 |
| Annealing behavior of Cu and dilute Cu-alloy films: Precipitation, grain growth, and resistivity K Barmak, A Gungor, C Cabral Jr, JME Harper Journal of applied physics 94 (3), 1605-1616, 2003 | 99 | 2003 |
| Method and process to make multiple-threshold metal gates CMOS technology R Amos, K Barmak, DC Boyd, C Cabral Jr, M Leong, TS Kanarsky, ... US Patent 6,846,734, 2005 | 97 | 2005 |
| Deterministic coupling of site-controlled quantum emitters in monolayer WSe 2 to plasmonic nanocavities Y Luo, GD Shepard, JV Ardelean, DA Rhodes, B Kim, K Barmak, JC Hone, ... Nature nanotechnology 13 (12), 1137-1142, 2018 | 93 | 2018 |
| Formation of boride layers at the Fe–10% Cr alloy–boron interface VI Dybkov, W Lengauer, K Barmak Journal of Alloys and Compounds 398 (1-2), 113-122, 2005 | 89 | 2005 |
| Grain growth and the puzzle of its stagnation in thin films: The curious tale of a tail and an ear K Barmak, E Eggeling, D Kinderlehrer, R Sharp, S Ta’asan, AD Rollett, ... Progress in Materials Science 58 (7), 987-1055, 2013 | 85 | 2013 |
| Phase formation sequence for the reaction of multilayer thin films of Nb/Al K Barmak, KR Coffey, DA Rudman, S Foner Journal of applied physics 67 (12), 7313-7322, 1990 | 81 | 1990 |
Anthony RollettProfessor of Materials Science and Engineering, Carnegie Mellon UniversityVerified email at andrew.cmu.edu
