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Y. S. Obeng
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Toward clean and crackless transfer of graphene
X Liang, BA Sperling, I Calizo, G Cheng, CA Hacker, Q Zhang, Y Obeng, ...
ACS nano 5 (11), 9144-9153, 2011
10402011
Metrology for the next generation of semiconductor devices
NG Orji, M Badaroglu, BM Barnes, C Beitia, BD Bunday, U Celano, ...
Nature electronics 1 (10), 532-547, 2018
4112018
Electrochemistry and Langmuir trough studies of fullerene C60 and C70 films
C Jehoulet, YS Obeng, YT Kim, F Zhou, AJ Bard
Journal of the American Chemical Society 114 (11), 4237-4247, 1992
3521992
Langmuir films of C60 at the air-water interface
YS Obeng, AJ Bard
Journal of the American Chemical Society 113 (16), 6279-6280, 1991
2511991
Electrogenerated chemiluminescence. 53. Electrochemistry and emission from adsorbed monolayers of a tris (bipyridyl) ruthenium (II)-based surfactant on gold and tin oxide …
YS Obeng, AJ Bard
Langmuir 7 (1), 195-201, 1991
2201991
Nanoporous ultralow dielectric constant organosilicates templated by triblock copolymers
S Yang, PA Mirau, CS Pai, O Nalamasu, E Reichmanis, JC Pai, YS Obeng, ...
Chemistry of materials 14 (1), 369-374, 2002
1772002
Influence of Metal–MoS2 Interface on MoS2 Transistor Performance: Comparison of Ag and Ti Contacts
H Yuan, G Cheng, L You, H Li, H Zhu, W Li, JJ Kopanski, YS Obeng, ...
ACS applied materials & interfaces 7 (2), 1180-1187, 2015
1272015
Chemical mechanical planarization of copper: role of oxidants and inhibitors
S Deshpande, SC Kuiry, M Klimov, Y Obeng, S Seal
Journal of The Electrochemical Society 151 (11), G788, 2004
1102004
Passivated copper surfaces
YS Obeng, JS Obeng
US Patent 6,323,131, 2001
1092001
A detailed failure analysis examination of the effect of thermal cycling on Cu TSV reliability
C Okoro, JW Lau, F Golshany, K Hummler, YS Obeng
IEEE Transactions on Electron Devices 61 (1), 15-22, 2013
1042013
Langmuir-Blodgett and electrochemical studies of fullerene films
LOS Bulhoes, YS Obeng, AJ Bard
Chemistry of materials 5 (1), 110-114, 1993
981993
Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces
H Lu, B Fookes, Y Obeng, S Machinski, KA Richardson
Materials Characterization 49 (1), 35-44, 2002
962002
Applicability of dynamic mechanical analysis for CMP polyurethane pad studies
H Lu, Y Obeng, KA Richardson
Materials Characterization 49 (2), 177-186, 2002
832002
Graphene: Is it the future for semiconductors? An overview of the material, devices, and applications
Y Obeng, P Srinivasan
The Electrochemical Society Interface 20 (1), 47, 2011
692011
Apparatus and method for continuous delivery and conditioning of a polishing slurry
YS Obeng, LD Schultz
US Patent 6,048,256, 2000
692000
Method of polishing
YS Obeng
US Patent 5,735,963, 1998
691998
Integrated circuit manufacturing
YS Obeng
US Patent 5,417,802, 1995
661995
Self-assembled monolayers of parent and derivatized [n] staffane-3, 3 (n-1)-dithiols on polycrystalline gold electrodes
YS Obeng, ME Laing, AC Friedli, HC Yang, D Wang, EW Thulstrup, ...
Journal of the American Chemical Society 114 (25), 9943-9952, 1992
651992
Integrated circuit fabrication process
YS Obeng, SC Vitkavage
US Patent 6,083,810, 2000
442000
Nondestructive measurement of the residual stresses in copper through-silicon vias using synchrotron-based microbeam X-ray diffraction
C Okoro, LE Levine, R Xu, K Hummler, YS Obeng
IEEE Transactions on Electron Devices 61 (7), 2473-2479, 2014
432014
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