Krishna Bharath
Krishna Bharath
Verified email at intel.com
Title
Cited by
Cited by
Year
Designing and modeling for power integrity
M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie
IEEE Transactions on Electromagnetic Compatibility 52 (2), 288-310, 2010
1392010
Multilayered finite-difference method (MFDM) for modeling of package and printed circuit board planes
AE Engin, K Bharath, M Swaminathan
IEEE Transactions on Electromagnetic Compatibility 49 (2), 441-447, 2007
982007
Finite-difference modeling of noise coupling between power/ground planes in multilayered packages and boards
AE Engin, K Bharath, M Swaminathan, M Cases, B Mutnury, N Pham, ...
56th Electronic Components and Technology Conference 2006, 6 pp., 2006
492006
Noise isolation in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN)
J Choi, V Govind, M Swaminathan, K Bharath
IEEE transactions on advanced packaging 33 (1), 2-12, 2009
402009
Reliable microstrip routing for electronics components
OG Karhade, N Altunyurt, KO Lee, K Bharath
US Patent 9,041,205, 2015
382015
Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM
K Bharath, E Engin, M Swaminathan
2008 45th ACM/IEEE Design Automation Conference, 560-565, 2008
292008
Use of the finite element method for the modeling of multi-layered power/ground planes with small features
K Bharathy, JY Choi, M Swaminathan
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 1630 …, 2009
212009
Magnetic core inductor (MCI) structures for integrated voltage regulators
AA Elsherbini, KP O'brien, H Braunisch, K Bharath
US Patent 9,129,817, 2015
192015
Power delivery design and analysis of 14nm multicore server CPUs with integrated voltage regulators
K Bharath, S Venkataraman
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 368-373, 2016
152016
System level signal and power integrity analysis methodology for system-in-package applications
R Mandrekar, K Bharath, K Srinivasan, E Engin, M Swaminathan
2006 43rd ACM/IEEE Design Automation Conference, 1009-1012, 2006
152006
Signal and power integrity co-simulation for multi-layered system on package modules
K Bharath, E Engin, M Swaminathan, K Uriu, T Yamada
2007 IEEE International Symposium on Electromagnetic Compatibility, 1-6, 2007
132007
Computationally efficient power integrity simulation for system-on-package applications
K Bharath, E Engin, M Swaminathan, K Uriu, T Yamada
2007 44th ACM/IEEE Design Automation Conference, 612-617, 2007
132007
Efficient modeling of package power delivery networks with fringing fields and gap coupling in mixed signal systems
K Bharath, E Engin, M Swaminathan, K Uriu, T Yamada
2006 IEEE Electrical Performane of Electronic Packaging, 59-62, 2006
132006
Modeling of multilayered packages and boards using modal decomposition and finite difference methods
AE Engin, K Bharath, K Srinivasan, M Swaminathan
2006 IEEE International Symposium on Electromagnetic Compatibility, 2006 …, 2006
112006
Configurable USB interface with virtual register architecture
D Luke, D Gilbert
US Patent 6,959,350, 2005
112005
Multi-layer finite element method for modeling of package power and ground planes
K Bharath, M Swaminathan
US Patent 8,219,377, 2012
82012
Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method
AE Engin, K Bharath, M Swaminathan
2007 IEEE International Symposium on Circuits and Systems, 1493-1496, 2007
82007
Efficient simulation of power/ground planes for SiP applications
K Bharath, E Engin, M Swaminathan, K Uriu, T Yamada
2007 Proceedings 57th Electronic Components and Technology Conference, 1199-1205, 2007
72007
Low loss and low cross talk transmission lines using shaped vias
AA Elsherbini, M Manusharow, K Bharath, Z Zhang, YS Mekonnen, ...
US Patent 9,992,859, 2018
52018
Google Scholar Crossref H
JS Wang, J Kuang, J Li, Y Luo, H Lu, G Hu
Yin, H. Yamaki, M. Komatsu, QM Zhang, JS Wang, Q. Tang, F. Saito, and T …, 2003
5*2003
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