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Daniel Wheeler
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Superconformal film growth: Mechanism and quantification
TP Moffat, D Wheeler, MD Edelstein, D Josell
IBM Journal of Research and Development 49 (1), 19-36, 2005
4612005
FiPy: Partial differential equations with Python
JE Guyer, D Wheeler, JA Warren
Computing in Science & Engineering 11 (3), 6-15, 2009
4552009
Superconformal electrodeposition of copper
TP Moffat, D Wheeler, WH Huber, D Josell
Electrochemical and Solid-State Letters 4 (4), C26, 2001
4362001
Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS
TP Moffat, D Wheeler, D Josell
Journal of The Electrochemical Society 151 (4), C262, 2004
3972004
Superconformal electrodeposition in submicron features
D Josell, D Wheeler, WH Huber, TP Moffat
Physical Review Letters 87 (1), 016102, 2001
2272001
Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers
D Josell, D Wheeler, C Witt, TP Moffat
Electrochemical and solid-state letters 6 (10), C143, 2003
1942003
A simple equation for predicting superconformal electrodeposition in submicrometer trenches
D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat
Journal of the Electrochemical Society 148 (12), C767, 2001
1922001
Modeling superconformal electrodeposition using the level set method
D Wheeler, D Josell, TP Moffat
Journal of The Electrochemical Society 150 (5), C302, 2003
1722003
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
TP Moffat, D Wheeler, SK Kim, D Josell
Electrochimica Acta 53 (1), 145-154, 2007
1712007
Curvature enhanced adsorbate coverage model for electrodeposition
TP Moffat, D Wheeler, SK Kim, D Josell
Journal of the Electrochemical Society 153 (2), C127, 2006
1672006
Formation mechanisms of self-organized core/shell and core/shell/corona microstructures in liquid droplets of immiscible alloys
RP Shi, CP Wang, D Wheeler, XJ Liu, Y Wang
Acta materialia 61 (4), 1229-1243, 2013
1442013
Modeling extreme bottom-up filling of through silicon vias
D Josell, D Wheeler, TP Moffat
Journal of the Electrochemical Society 159 (10), D570, 2012
1162012
Materials knowledge systems in python—a data science framework for accelerated development of hierarchical materials
DB Brough, D Wheeler, SR Kalidindi
Integrating materials and manufacturing innovation 6, 36-53, 2017
962017
Accelerator aging effects during copper electrodeposition
TP Moffat, B Baker, D Wheeler, D Josell
Electrochemical and solid-state letters 6 (4), C59, 2003
882003
Via filling by electrodeposition: Superconformal silver and copper and conformal nickel
D Josell, B Baker, C Witt, D Wheeler, TP Moffat
Journal of the Electrochemical Society 149 (12), C637, 2002
882002
Superconformal electrodeposition using derivitized substrates
TP Moffat, D Wheeler, C Witt, D Josell
Electrochemical and solid-state letters 5 (12), C110, 2002
792002
Spatial-temporal modeling of extreme bottom-up filling of through-silicon-vias
D Wheeler, TP Moffat, D Josell
Journal of The Electrochemical Society 160 (12), D3260, 2013
772013
Superconformal electrodeposition of silver from a KAg (CN) 2 KCN KSeCN electrolyte
BC Baker, M Freeman, B Melnick, D Wheeler, D Josell, TP Moffat
Journal of the Electrochemical Society 150 (2), C61, 2002
772002
Superfilling when adsorbed accelerators are mobile
D Josell, TP Moffat, D Wheeler
Journal of the Electrochemical Society 154 (4), D208, 2007
742007
Superconformal electrodeposition of silver in submicrometer features
TP Moffat, B Baker, D Wheeler, JE Bonevich, M Edelstein, DR Kelly, ...
Journal of the Electrochemical Society 149 (8), C423, 2002
712002
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