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Charandeep Singh
Charandeep Singh
Development Scientist - Reliability
Verified email at binghamton.edu
Title
Cited by
Cited by
Year
Investigation of underfilling BGAs packages–Thermal fatigue
VL Pham, J Xu, K Pan, J Wang, S Park, C Singh, H Wang
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2252-2258, 2020
202020
A study of substrate models and its effect on package warpage prediction
VL Pham, H Wang, J Xu, J Wang, S Park, C Singh
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1130-1139, 2019
172019
Experimentally minimizing the gap distance between extra tall packages and PCB using the digital image correlation (DIC) method
VL Pham, Y Niu, J Wang, H Wang, C Singh, S Park, C Zhong, SW Koh, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1593-1599, 2018
122018
Deformation of Display for Handheld Devices During Drop Impact
C Singh, S Chaparala, C Zhou, B Zhang, SB Park
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1990-1995, 2016
62016
Comparative study of analytical models to predict warpage in microelectronics packages
C Singh, Y Kim, S Park
ASME International Mechanical Engineering Congress and Exposition 46590 …, 2014
52014
Measurement of Dynamic Response Parameters of an Underdamped System
C Singh, S Chaparala, SB Park
Dynamic Behavior of Materials, Volume 1: Proceedings of the 2016 Annual …, 2017
32017
A study of warpage of electronic package and effect of reflow
C Singh
State University of New York at Binghamton, 2014
32014
Dynamic Fracture of Brittle Materials
C Singh
State University of New York at Binghamton, 2018
2018
Cloning, Expression, and Characterization of a Novel Putative Aldehyde Dehydrogenase from Escherichia coli K-12 Which Is Highly Active on 3-Hydroxypropionaldehyde
JE Jo, SM Raj, CR Singh, SH Park
한국생물공학회 학술대회, 197-197, 2008
2008
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