Bahgat G Sammakia

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Bruce T MurrayProfessor Emeritus, Mechanical Engineering, SUNY BinghamtonVerified email at binghamton.edu
Kourosh NematiResearch Manager at Future FacilitiesVerified email at binghamton.edu
Husam AlissaDirector - Systems TechnologyVerified email at microsoft.com
Kanad GhoseDept. of Computer ScienceVerified email at cs.binghamton.edu
Srikanth RangarajanSUNY BinghamtonVerified email at binghamton.edu
Ganesh SubbarayanProfessor of Mechanical Engineering, Purdue UniversityVerified email at purdue.edu
Mohammad I TradatState University of New York at BinghamtonVerified email at binghamton.edu
Saurabh ShrivastavaYP-II (Computer Applications), Indian Agricultural Statistics Research Institute, PusaVerified email at gnxtsystems.com
Madhusudan K IyengarGoogleVerified email at google.com
Siddharth BhopteR&D Engineer, Microsoft CorporationVerified email at microsoft.com
Sami AlkharabshehBinghamton UniversityVerified email at binghamton.edu
Yogendra JoshiProfessor of Mechanical Engineering, Georgia Institute of TechnologyVerified email at me.gatech.edu
Sadegh KhaliliGoogleVerified email at google.com
Bharath RamakrishnanMicrosoft, Datacenter Advanced Development (DAD)Verified email at binghamton.edu
Susan LuBinghamton UniversityVerified email at binghamton.edu
Refai-Ahmed, GamalUnknown affiliationVerified email at ge.com
Mark D PoliksSUNY Distinguished Professor, State University of New York at BinghamtonVerified email at binghamton.edu
Paul R ChiarotState University of New York at BinghamtonVerified email at binghamton.edu
Koneru RamakrishnaSenior Design and Simulation Engineer, Cirrus Logic, Inc.Verified email at ieee.org
Khalid Mohammad AlzoubiJordan University of Science and TechnologyVerified email at just.edu.jo

Bahgat G Sammakia

Binghamton University

Verified email at binghamton.edu - Homepage

Electronics packaging thermal sciences electronics cooling heat transfer


Title Sort by citations Sort by year Sort by title	Cited by Cited by	Year
Buoyancy-induced flows and transport B Gebhart CRC Press, 1988	1928	1988
Thermal challenges in next-generation electronic systems SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ... IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008	524	2008
Bending fatigue study of sputtered ITO on flexible substrate K Alzoubi, MM Hamasha, S Lu, B Sammakia Journal of Display Technology 7 (11), 593-600, 2011	249	2011
Pluggable electronic circuit package assembly with snap together heat sink housing J Funari, TC Godown, SD Reynolds, BG Sammakia US Patent 5,109,318, 1992	163	1992
Electronic package with heat spreader member M Anschel, BG Sammakia US Patent 4,914,551, 1990	148	1990
A review of recent developments in some practical aspects of air-cooled electronic packages S Sathe, B Sammakia	142	1998
Comparative analysis of different data center airflow management configurations S Shrivastava, B Sammakia, R Schmidt, M Iyengar International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005	126	2005
A brief overview of recent developments in thermal management in data centers S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ... Journal of Electronic Packaging 137 (4), 040801, 2015	124	2015
Experimental-numerical comparison for a high-density data center: Hot spot heat fluxes in excess of 500 W/ft2 SK Shrivastava, BG Sammakia, R Schmidt, M Iyengar, JW VanGilder Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006	110	2006
Thermal challenges in next generation electronic systems-summary of panel presentations and discussions SV Garimella, YK Joshi, A Bar-Cohen, R Mahajan, KC Toh, VP Carey, ... IEEE Transactions on Components and Packaging Technologies 25 (4), 569-575, 2002	104	2002
Optimization of data center room layout to minimize rack inlet air temperature S Bhopte, D Agonafer, R Schmidt, B Sammakia	103	2006
Method and apparatus for testing of integrated circuit chips M Anschel, AP Ingraham, CR Lamb, MD Lowell, VR Markovich, W Mayr, ... US Patent 5,420,520, 1995	101	1995
Electronic package having active means to maintain its operating temperature constant LSW Mok, S Purushothaman, BG Sammakia, JS Wilczynski, TY Wu US Patent 5,491,610, 1996	94	1996
A review of recent advances in thermal management in three dimensional chip stacks in electronic systems V Venkatadri, B Sammakia, K Srihari, D Santos	93	2011
Electronic package with improved heat sink J Funari, MC Green, SD Reynolds, BG Sammakia US Patent 4,849,856, 1989	91	1989
Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations SS Mahajan, G Subbarayan, BG Sammakia Physical Review E—Statistical, Nonlinear, and Soft Matter Physics 76 (5 …, 2007	83	2007
Flexible chemiresistor sensors: Thin film assemblies of nanoparticles on a polyethylene terephthalate substrate L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ... Journal of Materials Chemistry 20 (5), 907-915, 2010	81	2010
Control systems and prediction methods for it cooling performance in containment H Alissa, K Nemati, B Sammakia, K Ghose US Patent 11,076,509, 2021	71	2021
Predictive model for optimized design parameters in flip-chip packages and assemblies S Park, HC Lee, B Sammakia, K Raghunathan IEEE Transactions on Components and Packaging Technologies 30 (2), 294-301, 2007	69	2007
An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008	68	2008

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