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Co-authors
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- pramey upadhyayaPurdueVerified email at purdue.edu
- Juan G AlzateApple/Intel/UCLA/UniAndesVerified email at apple.com
- Vladislav KorenivskiKTH - Royal Institute of Technology, StockholmVerified email at kth.se
- Jordan KatineSenior Director, Western Digital Research DivisionVerified email at wdc.com
- Richard DorranceResearch Scientist at Intel LabsVerified email at intel.com
- Greg P. CarmanUCLAVerified email at seas.ucla.edu
- Alexander KhitunUniversity of California RiversideVerified email at engr.ucr.edu
- Björn Casper KoopNanostructure Physics, Royal Institute of Science, Stockholm, SwedenVerified email at kth.se
- Dejan MarkovicProfessor of Electrical and Computer Engineering, UCLAVerified email at ee.ucla.edu
- Tao WuShanghaiTech UniversityVerified email at shanghaitech.edu.cn
- Jiang WanjunDepartment of Physics, Tsinghua UniversityVerified email at tsinghua.edu.cn
- Jianshi TangTsinghua University / IBM Research / UCLAVerified email at tsinghua.edu.cn
- Yabin FanWestern Digital/MIT/UCLAVerified email at wdc.com
- Jian ZhuTDK-Headway, HGST, UC Irvine, USTCVerified email at uci.edu
- David B. HavilandKTH The Royal Institute of TechnologyVerified email at kth.se
- Yiming ChenASMLVerified email at asml.com