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Co-authors
Francis C.M. LauHong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Siu-Chung WongAssociate Professor, Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Siew-Chong TANUniversity of Hong KongVerified email at eee.hku.hk
Michael SmallThe University of Western AustraliaVerified email at uwa.edu.au
Chi-Tsun Cheng (Ben)RMIT UniversityVerified email at rmit.edu.au
Herbert Ho-Ching IuProfessor, School of Electrical, Electronic and Computer Engineering, The University of WesternVerified email at uwa.edu.au
Ka Hong LooAssociate Professor, The Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Xiaohui QuSoutheast UniversityVerified email at seu.edu.cn
Nuwan GanganathPhDVerified email at ganganath.lk
Yongxiang XiaProfessor, Hangzhou Dianzi UniversityVerified email at hdu.edu.cn
Wei ZhangDENSO International America, Inc.Verified email at umich.edu
Shiyuan WangProfessor, College of Electronic and Information Engineering, Southwest UniversityVerified email at swu.edu.cn
Mario di BernardoUniversità di Napoli Federico IIVerified email at unina.it
Meng HUANGAssociate Professor of Electrical Engineering, Wuhan UniversityVerified email at whu.edu.cn
Jiajing WuSun Yat-sen UniversityVerified email at mail.sysu.edu.cn
Dong Dai(戴栋)South China University of TechnologyVerified email at scut.edu.cn
Octavian DrangaEdith Cowan UniversityVerified email at ecu.edu.au
Geza KolumbanFull Prof., Faculty of Information Eng., Pazmany Peter Catholic University Verified email at itk.ppke.hu
Ivan Wang-Hei HoThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
LIU Xiao Fan, 刘肖凡City University of Hong KongVerified email at cityu.edu.hk
Chi K. TSE (Garbled as K.T. Chi)
City University of Hong Kong (was with HK Polytechnic Univ.)
Verified email at ieee.org