| Re-wearable wireless device L Arne, T Thompson, T Robertson, R Azevedo US Patent 9,439,566, 2016 | 278 | 2016 |
| Silicon carbide microsystems for harsh environments M Wijesundara, R Azevedo Springer Science & Business Media, 2011 | 241 | 2011 |
| A SiC MEMS resonant strain sensor for harsh environment applications RG Azevedo, DG Jones, AV Jog, B Jamshidi, DR Myers, L Chen, X Fu, ... IEEE Sensors Journal 7 (4), 568-576, 2007 | 225 | 2007 |
| Communication system with enhanced partial power source and method of manufacturing same J Frank, P Bjeletich, H Hafezi, R Azevedo, R Duck, I Pesic, B Costello, ... US Patent 10,517,507, 2019 | 99* | 2019 |
| Communication system with enhanced partial power source and method of manufacturing same J Frank, P Bjeletich, H Hafezi, R Azevedo, R Duck, I Pesic, B Costello, ... US Patent 9,962,107, 2018 | 67 | 2018 |
| Dual-mode temperature compensation for a comb-driven MEMS resonant strain gauge RG Azevedo, W Huang, OM O’Reilly, AP Pisano Sensors and Actuators A: Physical 144 (2), 374-380, 2008 | 49 | 2008 |
| Silicon carbide resonant tuning fork for microsensing applications in high-temperature and high G-shock environments DR Myers, KB Cheng, B Jamshidi, RG Azevedo, DG Senesky, L Chen, ... Journal of Micro/Nanolithography, MEMS and MOEMS 8 (2), 021116-021116-7, 2009 | 43 | 2009 |
| Silicon carbide coated MEMS strain sensor for harsh environment applications RG Azevedo, J Zhang, DG Jones, DR Myers, AV Jog, B Jamshidi, ... 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems …, 2007 | 42 | 2007 |
| SiC materials and processing technology MBJ Wijesundara, R Azevedo, MBJ Wijesundara, RG Azevedo Silicon carbide microsystems for harsh environments, 33-95, 2011 | 41 | 2011 |
| Systems and methods for resolving ingestible event marker (iem) contention A Dua, M Zdeblick, L Arne, J Withrington, W McAllister, A Shirvani, ... US Patent App. 15/190,741, 2016 | 29 | 2016 |
| Passive substrate temperature compensation of doubly anchored double-ended tuning forks DR Myers, RG Azevedo, L Chen, M Mehregany, AP Pisano Journal of microelectromechanical systems 21 (6), 1321-1328, 2012 | 26 | 2012 |
| Rapid silicon-to-steel bonding by induction heating for MEMS strain sensors BD Sosnowchik, RG Azevedo, DR Myers, MW Chan, AP Pisano, L Lin Journal of Microelectromechanical Systems 21 (2), 497-506, 2012 | 23 | 2012 |
| Methods for manufacturing capsules with ingestible event markers RD Jeremy Frank, Nikhil Pargaonkar, Raymond Schmidt, Robert Azevedo, Kurt ... US Patent 10,820,831, 2020 | 22 | 2020 |
| Low temperature ion beam sputter deposition of amorphous silicon carbide for wafer-level vacuum sealing DG Jones, RG Azevedo, MW Chan, AP Pisano, MBJ Wijesundara 2007 IEEE 20th International Conference on Micro Electro Mechanical Systems …, 2007 | 22 | 2007 |
| Torque measurements of an automotive halfshaft using micro double-ended tuning fork strain gauges DR Myers, MW Chan, G Vigevani, BD Sosnowchik, RG Azevedo, AV Jog, ... Sensors and Actuators A: Physical 204, 79-87, 2013 | 16 | 2013 |
| An in-vivo communication system for monitoring medication adherence A Dua, WA Weeks, A Berstein, RG Azevedo, R Li, A Ward 2017 IEEE Wireless Communications and Networking Conference (WCNC), 1-6, 2017 | 11 | 2017 |
| Silicon-to-steel bonding using rapid thermal annealing BD Sosnowchik, RG Azevedo, A Cao, L Lin, AP Pisano IEEE transactions on advanced packaging 28 (4), 626-634, 2005 | 11 | 2005 |
| Chitin-based cantilever bimorphs and readout devices MT Mueller, AP Pisano, R Azevedo, DC Walther, DR Myers, M Wasilik US Patent 8,026,485, 2011 | 10 | 2011 |
| A low-power, low-cost ingestible and wearable sensing platform to measure medication adherence and physiological signals WA Weeks, A Dua, J Hutchison, R Joshi, R Li, J Szejer, RG Azevedo 2018 40th Annual International Conference of the IEEE Engineering in …, 2018 | 9 | 2018 |
| Influence of sensor substrate geometry on the sensitivity of mems micro-extensometers RG Azevedo, I Chen, OM O’Reilly, AP Pisano ASME International Mechanical Engineering Congress and Exposition 4224, 307-312, 2005 | 9 | 2005 |
Liwei LinProfessor of Mechanical Engineering, University of California at BerkeleyVerified email at me.berkeley.edu
