| A comparative study of predictive current control schemes for a permanent-magnet synchronous machine drive F Morel, X Lin-Shi, JM Retif, B Allard, C Buttay IEEE transactions on industrial electronics 56 (7), 2715-2728, 2009 | 484 | 2009 |
| State of the art of high temperature power electronics C Buttay, D Planson, B Allard, D Bergogne, P Bevilacqua, C Joubert, ... Materials Science and Engineering: B 176 (4), 283-288, 2011 | 465 | 2011 |
| Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles J Li, CM Johnson, C Buttay, W Sabbah, S Azzopardi Journal of Materials Processing Technology 215, 299-308, 2015 | 133 | 2015 |
| Power electronic package having two substrates with multiple semiconductor chips and electronic components RK Malhan, CM Johnson, C Buttay, J Rashid, F Udrea US Patent 7,999,369, 2011 | 107 | 2011 |
| Thermal stability of silicon carbide power diodes C Buttay, C Raynaud, H Morel, G Civrac, ML Locatelli, F Morel IEEE Transactions on electron devices 59 (3), 761-769, 2012 | 106 | 2012 |
| Packaged Ga2O3 Schottky Rectifiers With Over 60-A Surge Current Capability M Xiao, B Wang, J Liu, R Zhang, Z Zhang, C Ding, S Lu, K Sasaki, GQ Lu, ... IEEE Transactions on Power Electronics 36 (8), 8565-8569, 2021 | 105 | 2021 |
| Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors H Reynes, C Buttay, H Morel 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2017 | 94 | 2017 |
| Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs C Chen, D Labrousse, S Lefebvre, M Petit, C Buttay, H Morel Microelectronics Reliability 55 (9-10), 1708-1713, 2015 | 92 | 2015 |
| Die attach of power devices using silver sintering-bonding process optimization and characterization C Buttay, A Masson, J Li, MC Johnson, M Lazar, C Raynaud, H Morel HiTEN 2011, 1-7, 2011 | 88 | 2011 |
| Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective Y Qin, B Albano, J Spencer, JS Lundh, B Wang, C Buttay, M Tadjer, ... Journal of physics D: applied physics 56 (9), 093001, 2023 | 68 | 2023 |
| Design and implementation of integrated common mode capacitors for SiC-JFET inverters R Robutel, C Martin, C Buttay, H Morel, P Mattavelli, D Boroyevich, ... IEEE transactions on power electronics 29 (7), 3625-3636, 2013 | 68 | 2013 |
| Compact double-side liquid-impingement-cooled integrated power electronic module CM Johnson, C Buttay, SJ Rashid, F Udrea, GAJ Amaratunga, P Ireland, ... Proceedings of the 19th International Symposium on Power Semiconductor …, 2007 | 63 | 2007 |
| Migration issues in sintered-silver die attaches operating at high temperature R Riva, C Buttay, B Allard, P Bevilacqua Microelectronics Reliability 53 (9-11), 1592-1596, 2013 | 61 | 2013 |
| High performance cooling system for automotive inverters C Buttay, J Rashid, CM Johnson, P Ireland, F Udrea, G Amaratunga, ... 2007 European Conference on Power Electronics and Applications, 1-9, 2007 | 53 | 2007 |
| Thermal management and electromagnetic analysis for GaN devices packaging on DBC substrate C Yu, C Buttay, E Laboure IEEE Transactions on Power Electronics 32 (2), 906-910, 2016 | 48 | 2016 |
| Application of the PCB-embedding technology in power electronics–State of the art and proposed development C Buttay, C Martin, F Morel, R Caillaud, J Le Leslé, R Mrad, N Degrenne, ... 2018 Second International Symposium on 3D Power Electronics Integration and …, 2018 | 47 | 2018 |
| Full densification of molybdenum powders using spark plasma sintering B Mouawad, M Soueidan, D Fabregue, C Buttay, V Bley, B Allard, H Morel Metallurgical and Materials Transactions A 43, 3402-3409, 2012 | 46 | 2012 |
| Wave transmission reduction by a piezoelectric semi-passive technique A Faiz, D Guyomar, L Petit, C Buttay sensors and Actuators A: Physical 128 (2), 230-237, 2006 | 44 | 2006 |
| Low thermal resistance (0.5 K/W) Ga₂O₃ Schottky rectifiers with double-side packaging B Wang, M Xiao, J Knoll, C Buttay, K Sasaki, GQ Lu, C Dimarino, Y Zhang IEEE Electron Device Letters 42 (8), 1132-1135, 2021 | 43 | 2021 |
| Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy W Sabbah, S Azzopardi, C Buttay, R Meuret, E Woirgard Microelectronics Reliability 53 (9-11), 1617-1621, 2013 | 42 | 2013 |
Hervé MorelSenior Researcher (Directeur de Recherche), Univ Lyon, CNRS, INSA Lyon, Lab. AmpèreVerified email at insa-lyon.fr
